pb lead-free parts doc. no : qw0905-LUR63233H-PF rev. : a date : 21 - jul. - 2007 data sheet round type led lamps LUR63233H-PF ligitek electronics co.,ltd. property of ligitek only
30 60 0 75% 50% 0 25%100% 50% 25% -60 100%75% -30 1/5 page LUR63233H-PF part no. ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 4.8 5.8 0.6 4.4 r2.4 2.54typ 1.0min + - 1.5max 0.5 typ 25.0min
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr esd symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v electrostatic discharge( * ) storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 130 -40 ~ +100 -40 ~ +85 ir 2000 10 ratings ur(h) 100 50 mw v a ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/5 60 viewing angle 2 1/2 (deg) min. 450 20 min. 1.7 forward voltage @ ma(v) max. 2.6 dominant wave length dnm 630 spectral halfwidth nm 20 typ. luminous intensity @20ma(mcd) 700 emitted red part no LUR63233H-PF material algainp/gap lens color water clear static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LUR63233H-PF
fig.4 relative intensity vs. temperature 3.0 2.5 2.0 1.5 0.5 1.0 0.0 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 550 0.0 0.5 600650700 fig.3 forward voltage vs. temperature 0 fig.5 relative intensity vs. wavelength ambient temperature( ) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 0.9 1.1 1.2 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 80 40 2060100 ambient temperature( ) -20 -4020 060 4080100 3.0 2.0 1.0 1.5 2.5 fig.2 relative intensity vs. forward current typical electro-optical characteristics curve 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.1 forward current vs. forward voltage forward voltage(v) f o r w a r d c u r r e n t ( m a ) 1.0 0 1 1.5 10 1 100 ur(h) chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 2.02.53.0 3/5 page forward current(ma) 1101001000 3.5 part no. LUR63233H-PF
60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. page 4/5 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 260 c3sec max 260 temp( c) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile 150 5 /sec max 120 100 50 0 0 preheat 25 2 /sec max time(sec) part no. LUR63233H-PF
5/5 page ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 description test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test item operating life test high temperature storage test reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs low temperature storage test high temperature high humidity test thermal shock test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. solderability test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test part no. LUR63233H-PF
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